ANCIS Incorporated                                                                                                                                             

ANCIS Incorporated was established in 2003 in response to a growing need for indoor climate, HVAC, and energy solutions based on advanced computer modeling. Our promise is to deliver best-in-class solutions for facilities in general and mission-critical facilities in particular. ANCIS is headquartered in San Francisco, CA. For contact information, please see our Contact Us page.

Dr. Magnus K. Herrlin, President
Prior to establishing ANCIS, he was a Principal Scientist at Telcordia Technologies (Bellcore) where he optimized the network environment to minimize service downtime and operating costs. Prior to his Telcordia tenure, he developed models at Lawrence Berkeley Laboratory for analyzing the indoor climate and energy performance of buildings.  

Magnus' expertise has generated numerous papers, reports, and standards, including thermal management, energy management, mechanical system design and operation, and network reliability. Specifically, he has authored thermal guidelines for data centers and telecom equipment rooms. He is co-recipient of the prestigious 2004 ASHRAE Technical Paper Award for "Evolution of Data Center Environmental Guidelines."

He is a Founding Member of ASHRAE Committee TC 9.9 "Mission Critical Facilities, Technology Spaces, and Electronic Equipment", and Chair of Critical Facilities Round Table (CFRT) Committee "High Density Data Center." He has a Ph.D. in Building Services Engineering.

ANCIS-ECS
Through the Joint Venture of ANCIS-ECS, ANCIS Incorporated and Electronic Cooling Solutions Inc (ECS) combine ANCIS' expertise and proven track record in the design of thermal, cooling, and energy systems in electronic equipment facilities with ECS' extensive experience in cooling of electronic equipment enclosures and CFD modeling.  This collaboration enables ANCIS and ECS to offer a comprehensive set of services to address the thermal design of equipment rooms.

The Joint Venture allows ANCIS and ECS to provide our clients with a single engineering resource that can evaluate and design thermal solutions that address the overall business and thermal requirements.  ANCIS-ECS have the knowledge, experience, and resources to address the full spectrum of electronic thermal design from the package to the system to the room.

ANCIS-ECS and our parent companies do not sell products to equipment manufacturers or equipment end-users. Therefore, we provide exceptional thermal solutions without an agenda to promote specific products or third-party solutions. ANCIS-ECS is uniquely positioned to develop optimized solutions, and we have a proven track record of completing successful high-profile projects.